Sign In | Join Free | My phrmg.org
phrmg.org
Shenzhen Goldensun Electronics Technology Limited
Shenzhen Goldensun Electronics Technology Limited Good At Quoting For BOM List Including IC, Diode, Transistor, Capacitor, Resistor And So On !
Home > Integrated Circuit IC Chip >

Non - Volatile Memory Integrated Circuit Chip 64M X 8 133MHz S25FL512SAGMFI011

Shenzhen Goldensun Electronics Technology Limited

Non - Volatile Memory Integrated Circuit Chip 64M X 8 133MHz S25FL512SAGMFI011

Model Number : S25FL512SAGMFI011
Part Status : Active
Memory Type : Non-Volatile
Memory Format : FLASH
Technology : FLASH - NOR
Memory Size : 512Mb (64M x 8)
Clock Frequency : 133MHz
Write Cycle Time - Word, Page : -
Memory Interface : SPI - Quad I/O
Contact Now

S25FL512SAGMFI011 Integrated Circuit IC Chip FLASH - NOR Memory IC 512Mb (64M x 8) SPI - Quad I/O 133MHz 16-SOIC


Part StatusActive
Memory TypeNon-Volatile
Memory FormatFLASH
TechnologyFLASH - NOR
Memory Size512Mb (64M x 8)
Clock Frequency133MHz
Write Cycle Time - Word, Page-
Memory InterfaceSPI - Quad I/O
Voltage - Supply2.7 V ~ 3.6 V
Operating Temperature-40°C ~ 85°C (TA)
Mounting TypeSurface Mount
Package / Case16-SOIC (0.295", 7.50mm Width)
Supplier Device Package16-SOIC

Notice On Data Sheet Designations

Spansion Inc. issues data sheets with Advance Information or Preliminary designations to advise readers of product information or intended specifications throughout the product life cycle, including development, qualification, initial production, and full production. In all cases, however, readers are encouraged to verify that they have the latest information before finalizing their design. The following descriptions of Spansion data sheet designations are presented here to highlight their presence and definitions.


Advance Information

The Advance Information designation indicates that Spansion Inc. is developing one or more specific products, but has not committed any design to production. Information presented in a document with this designation is likely to change, and in some cases, development on the product may discontinue. Spansion Inc. therefore places the following conditions upon Advance Information content:

“This document contains information on one or more products under development at Spansion Inc. The information is intended to help you evaluate this product. Do not design in this product without contacting the factory. Spansion Inc. reserves the right to change or discontinue work on this proposed product without notice.”


Preliminary

The Preliminary designation indicates that the product development has progressed such that a commitment to production has taken place. This designation covers several aspects of the product life cycle, including product qualification, initial production, and the subsequent phases in the manufacturing process that occur before full production is achieved. Changes to the technical specifications presented in a Preliminary document should be expected while keeping these aspects of production under consideration. Spansion places the following conditions upon Preliminary content:

“This document states the current technical specifications regarding the Spansion product(s) described herein. The Preliminary status of this document indicates that product qualification has been completed, and that initial production has begun. Due to the phases of the manufacturing process that require maintaining efficiency and quality, this document may be revised by subsequent versions or modifications due to changes in technical specifications.”


Combination

Some data sheets contain a combination of products with different designations (Advance Information, Preliminary, or Full Production). This type of document distinguishes these products and their designations wherever necessary, typically on the first page, the ordering information page, and pages with the DC Characteristics table and the AC Erase and Program table (in the table notes). The disclaimer on the first page refers the reader to the notice on this page.


Full Production (No Designation on Document)

When a product has been in production for a period of time such that no changes or only nominal changes are expected, the Preliminary designation is removed from the data sheet. Nominal changes may include those affecting the number of ordering part numbers available, such as the addition or deletion of a speed

option, temperature range, package type, or VIO range. Changes may also include those needed to clarify a description or to correct a typographical error or incorrect specification. Spansion Inc. applies the following conditions to documents in this category:

“This document states the current technical specifications regarding the Spansion product(s) described herein. Spansion Inc. deems the products to have been in sufficient production volume such that subsequent versions of this document are not expected to change. However, typographical or specification corrections, or modifications to the valid combinations offered may occur.”


Questions regarding these document designations may be directed to your local sales office.


Features

n Density

– 512 Mbits (64 Mbytes)

n Serial Peripheral Interface (SPI)

– SPI Clock polarity and phase modes 0 and 3

– Double Data Rate (DDR) option

– Extended Addressing: 32-bit address

– Serial Command set and footprint compatible with S25FL-A, S25FL-K, and S25FL-P SPI families

– Multi I/O Command set and footprint compatible with S25FL-P SPI family

n READ Commands

– Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad DDR

– AutoBoot - power up or reset and execute a Normal or Quad read command automatically at a preselected address

– Common Flash Interface (CFI) data for configuration information.

n Programming (1.5 Mbytes/s)

– 512-byte Page Programming buffer

– Quad-Input Page Programming (QPP) for slow clock systems

n Erase (0.5 to 0.65 Mbytes/s)

– Uniform 256-kbyte sectors

n Cycling Endurance

– 100,000 Program-Erase Cycles on any sector typical

n Data Retention

– 20 Year Data Retention typical


n Security features

– One Time Program (OTP) array of 1024 bytes

– Block Protection:

– Status Register bits to control protection against program or erase of a contiguous range of sectors.

– Hardware and software control options

– Advanced Sector Protection (ASP)

– Individual sector protection controlled by boot code or password

n Spansion® 65 nm MirrorBit Technology with Eclipse Architecture

n Core Supply Voltage: 2.7V to 3.6V

n I/O Supply Voltage: 1.65V to 3.6V

– SO16 and FBGA packages

n Temperature Range:

– Industrial (-40°C to +85°C)

– Automotive In-Cabin (-40°C to +105°C)

n Packages (all Pb-free)

– 16-lead SOIC (300 mil)

– BGA-24 6 x 8 mm

– 5 x 5 ball (FAB024) and 4 x 6 ball (FAC024) footprint options

– Known Good Die and Known Tested Die

ItemPackageManufacturerQTY
SCH4304-NSQFPSMSC10953
SCI7500FOAQFPEPSON9991
SCN01A9836-6QFPUT29
SCS138E110QFPMOT27
SCX6232WBFVF8QFPNEC115
SDA6000-QH-A23QFPMICRONAS4000
SE1079LMR-NTQFPSAMSUNG61
SE6181LA-LFQFPMstar2076
SE859MRD-LFQFPSAMSUNG220
SED1191FOBQFPSEIKO215
SED1278FQFPEPSON400
SED1278FOAQFPEPSON129
SED1335QFPEPSON5
SGTV5910CA4-FBXQFPFREESCALE50
SH66P51PQFPSINOWEA81
SH67P54F-DA018QFPSINOWEALT1976
SH79F163PQFP28
SH86276P064PRQFPSINOWEALT143
Si3226-C-FQQFPSilicon800
SII0649CLUQFPSILICON6522
SII170BCL64QFPSILICON2483
SII7171CLUQFPSILICON14
SII851CT100QFPSIL893
SII9033CTUQFPSiliconIm19966
SIL101CT80QFPSiIionIma85
SIL3112QFPSILICON4366
SIL9226X01QFPSAMSUNG2300
SIL9489ACTUCQFPSILICON387
SIO1049-JVQFPSMSC502
SIS85C496QFPSIS255
SK6211BBPC8AQFPSKYMEI52783
SL11R-IDE-B1.22QFPCYPRESS524
SLA3055F2VQFPSEC1620
SLA312TF0SQFPEPSON368
SLK2701IPZPQFPTEXAS180
SM222TF-ADQFPSM675
SM223TFACQFPSILICON689
SM3211TBCQFPsm30000
SM321QF BBQFPSMI24669
SM3251QBBQFPSM619
SM3254Q AEQFPSM124
SM3257ENTAAQFPSMI1268
SM5819HQFQFPNPC93
SM8150QFPNPC50
SM89516C25QPQFPSYNCMOS1536
SM8951C25QQFPMOSEL100
SMC621AFQFPSEIKO142
SMC62T3FOJQFPEPSON181

Product Tags:

ic electronic components

      

integrated circuit kit

      
China Customized Inflatable Bumper Ball Game Bubble Adult Grass CE supplier

Non - Volatile Memory Integrated Circuit Chip 64M X 8 133MHz S25FL512SAGMFI011 Images

Inquiry Cart 0
Send your message to this supplier
 
From:
To: Shenzhen Goldensun Electronics Technology Limited
Subject:
Message:
Characters Remaining: (0/3000)